SV's New 3mm Board to Board Interconnect

Features & Benefits

• 3mm board-to-board spacing
• .150" minimum pitch between adjacent connectors
• Low-force, solderless installation does not damage PCB
• DC - 40 GHz
• And More!

Applications

• Embedded Computing
• High density stacked PCB applications
• High density multiport applications

Download our Application Note. View the entire product line: SV Microwave 3mm Board-to-Board Interconnects